Diamond Mold Precautions

Matters needing attention in sandpaper grinding and whetstone grinding of molds:

(1) For the mold surface with higher hardness, only clean and soft whetstone polishing tools can be used.

(2) When changing the sand number level during polishing, the workpiece and the operator's hands must be cleaned, so as to avoid the coarse sand particles from being carried to the next finer grinding operation.

(3) During each polishing process, the sandpaper should be polished from a different angle of 45° until the previous level of sand grain is eliminated. After the previous level of sand grain is removed, the sanding must be extended by 25%. Time, and then you can switch to the next finer sand number.

(4) Changing different directions when grinding can avoid the unevenness of the workpiece such as waves.